-
1 in-process wafer
оброблювана напівпровідникова пластинаEnglish-Ukrainian dictionary of microelectronics > in-process wafer
-
2 wafer
1) напівпровідникова пластина 2) пластина; плата; підкладка - building-block wafer
- bumped wafer
- chem-mesh polished wafer
- composite wafer
- customed wafer
- device wafer
- enhanced gettered wafer
- epitaxial wafer
- etch-separated wafer
- flat wafer
- foundry wafer
- frame-mounted semiconductor wafer
- frame-mounted wafer
- grown-junction wafer
- heavily strained wafer
- IC wafer
- imperfect wafer
- in-process wafer
- low yielding wafer
- LSI wafer
- master-slice wafer
- mixed crystal wafer
- MOS wafer
- multichip [multi-product] wafer
- optically flat wafer
- planar wafer
- p-n wafer
- prediffused wafer
- process development wafer
- processed wafer
- process validation wafer
- production wafer
- raw wafer необроблена пластина
- resist-coated wafer
- sample wafer
- sapphire wafer
- saw-scribed wafer
- scribed wafer
- SOS wafer
- spin-dry wafer
- substrate wafer
- uncommitted wafer
- vapor-phase epitaxial wafer
- (100) wafer -
3 process
1. ім.1) процес; (технологічний) метод, спосіб2) технологія (див. т-ж technique, technology)3) (технологічна) обробка; технологічна операція2. дієсл. обробляти; проводити технологічну операцію - all-ion-implant process
- all-planar process
- Auger process
- batch process
- BH bias and hardness process
- BH process
- bonding process
- BOX process
- bulk CMOS process
- bumping process
- chip-on-board process
- closed CMOS process
- CMOS-on-sapphire process
- composite сеll logic process
- contact process
- conventional process
- deep охide isolation process
- DIFET process
- diffused eutectic aluminum process
- direct synthesis and crystal pull process
- double-diffused process
- double ion-implanted process
- double-layer polysilicon gate MOS process
- double-layer polysilicon gate process
- epitaxial deposition process
- epitaxial process
- epitaxial growth process
- flip-over process
- floating-gate silicon process
- front-end process
- gold-doped process
- guard-banded CMOS process
- heterogeneous process
- high-voltage process
- HMOS process
- imaging process
- implantation process
- in-house process
- interconnection process
- inverted meniscus process
- ion plating process
- isoplanar -S, -Z, -2 process
- isoplanar process
- junction-isolated process
- laser-recrystallized process
- lithographic process
- low-pressure process
- low VT process
- lost wafer process
- major process
- masking process
- master slice process
- mesa-isolation process
- metal-gate MOS process
- metal-gate process
- microbipolar LSI process
- micrometer-dimension process
- mid-film process
- Minimod process
- Mo-gate MOS process
- Mo-gate process
- nitride process
- nitrideless process
- NSA process
- oxide-film isolation process
- oxide isolated process
- oxygen refilling process
- patterning process
- phosphorous buried-emitter process
- photoablative process
- photolithography process
- photoresist process
- planar oxidation process
- Planox process
- plasma etch process
- Poly I process
- Poly II process
- Poly 5 process
- poly-oxide process
- Poly-Si process
- polysilicon-gate process
- poly-squared MOS process
- proprietary process
- PSA bipolar process
- PSA process
- refractory metal MOS process
- refractory metal process
- sacrificial охide process
- sapphire dielectric isolation process
- scaled Poly 5 process
- screen-and-fire process
- selective field-охidation process
- self-aligned gate process
- self-aligned process
- self-registered gate process
- self-registered process
- semi-additive process
- semiconductor-thermoplastic-dielectric process
- semicustom process
- shadow masking process
- silk-screen process
- single poly process
- SMOS process
- SOS/CMOS process
- stacked fuse bipolar process
- Stalicide process
- step-and-repeat process
- subtractive-fabrication process
- surface process
- Telemos process
- thermal process
- thermally асtivated surface process
- thermal-охidation process
- three-mask process
- triple-diffused process
- triply-poly process
- twin-tub process
- twin-well process
- V-groove MOS process
- V-groove process
- wet process
- 3-D process -
4 process development wafer
тестова пластина, яка застосовується при розробці технологічного процесуEnglish-Ukrainian dictionary of microelectronics > process development wafer
-
5 process validation wafer
пластина, піддана (технологічній) обробціEnglish-Ukrainian dictionary of microelectronics > process validation wafer
-
6 lost wafer process
процес травлення підкладки. Технологія, яка використовує селективне травлення для видалення більшої частини підкладки і частини дифузійного шару, що залишиласяEnglish-Ukrainian dictionary of microelectronics > lost wafer process
-
7 processing
1) (технологічна) обробка; проведення процесу 2) технологія (див. т-ж process, technique, technology) 3) обробка (інформації) - array processing
- batch-modeprocessing
- batchprocessing
- beam processing
- bipolar processing
- chip processing
- CMOS/SOS processing
- component pre-insertion processing
- component processing
- computer word processing
- digital image processing
- dry processing
- electroless processing
- electron-beam processing
- epitaxial processing
- excimer laser processing
- exposive-shock processing
- fabrication processing
- hands-off processing
- high-resolution processing
- high-temperature processing
- high-volume processing
- high-yield processing
- image processing
- in-line processing
- ion-beam processing
- ion-implantation processing
- isothermal processing
- laser cold processing
- liquid chemical processing
- liquid processing
- lithographic processing
- maskless processing
- microelectronic processing
- microgravity processing
- MOS processing
- multimask processing
- multi-User MEMS processing MUMPS
- multi-User MEMS processing
- multiple-chemical processing
- on-line data processing
- pel-to-pel processing
- photochemical processing
- photoresist processing
- pipeline processing
- planar processing
- planar plasma processing
- plasma processing
- post ion-implantation processing
- pyrolytic laser processing
- radiation-free processing
- relief-mask processing
- single-wafer semiconductor processing
- single-wafer processing
- slice-at-a-time processing
- space semiconductor processing
- submicrometer processing
- submicron processing ї
- TAB processing
- temperature-gradient zone-melting processing
- thermal processing
- unattended processing
- vacuum infrared processing
- vertical processing
- wafer-by-wafer processing
- wet chemical processing
- wet processingEnglish-Ukrainian dictionary of microelectronics > processing
-
8 repeatability
English-Ukrainian dictionary of microelectronics > repeatability
-
9 station
1) (робоча) позиція; робоче місце 2) пристрій; устаткування - assembly station
- CAD work station
- CAD station
- cassette-to-cassette end station
- clean work station
- color work station
- graphic station
- interactive display station
- ion etching station
- laminar-flow station
- modular station
- pickup station
- prefunctional test station
- probe station
- soldering station
- test station
- wafer handling station
- wafer inspection station
- WIP station
- work station
- workpiece-in-process station -
10 technolog/y
1) технологія (див. т-ж арproach, technique) 2) техніки - advanced technolog/y
- alignment technolog/y
- analog technolog/y
- baseline technolog/y
- basic technolog/y
- batch technolog/y
- beam-tape technolog/y
- bi-FET technolog/y
- bi-MOS technolog/y
- BIMOS technolog/y
- bipolar technolog/y
- bit-slice technolog/y
- beardless technolog/y
- BSA technolog/y
- bubble technolog/y
- bumping technolog/y
- CAD technolog/yies
- CCD technolog/y
- cell array technolog/y
- cermet technolog/y
- CMOS technolog/y
- coating technolog/y
- cryogenic technolog/y
- current technolog/y
- custom-design technolog/y
- deep-ultraviolet photolithographic technolog/y
- dense LSI technolog/y
- diffused epitaxial planar technolog/y
- diffusion technolog/y
- digital technolog/y
- dominant technolog/y
- dry technolog/y
- dry chemical etching technolog/y
- ECL technolog/y
- electron technolog/y
- electron-beam exposure technolog/y
- electron-parts technolog/y
- electro-optical technolog/y
- epibase technolog/y
- epiplanar technolog/y
- epitaxial planar technolog/y
- film-carrier technolog/y
- fine-line technolog/y
- flip-chip bonding technolog/y
- flip-chip technolog/y
- full-slice technolog/y
- fuse-link technolog/y
- fusible-link technolog/y
- gallium arsenide technolog/y
- gate-array technolog/y
- high technolog/y
- high-density technolog/y
- high-electron mobility transistor technolog/y
- “high-end” technolog/y
- high-speed technolog/y
- hybrid technolog/y
- industry-standard MOS technolog/y
- information technolog/y
- inner-lead bonding technolog/y
- integration technolog/y
- interconnection technolog/y
- isoplanar technolog/y
- J-FET technolog/y
- Josephson-junctiontechnolog/y
- Josephsontechnolog/y
- leading-edge technolog/y
- lithographic technolog/y
- logic technolog/y
- low technolog/y
- “low-end” technolog/y
- low-power technolog/y
- magnetic-bubble technolog/y
- mainstream technolog/y
- mask-fabrication technolog/y
- master-slice technolog/y
- merged bipolar technolog/y
- merged technolog/y
- metal-board technolog/y
- metallization technolog/y
- microcircuit technolog/y
- microelectronic technolog/y
- microsystems technolog/y MST
- microsystems technolog/y
- MIS technolog/y
- mixed technolog/y
- monolithic technolog/y
- MOS technolog/y
- MTL technolog/y
- multilayer-wiring technolog/y
- multiple-epitaxial planar technolog/y
- n-channel technolog/y
- optical lithographic technolog/y
- oxide-isolated monolithic technolog/y
- passivation technolog/y
- p-channel technolog/y
- p-channel Si-gate technolog/y
- photofabrication technolog/y
- planar fabrication technolog/y
- planar technolog/y
- plasma technolog/y
- plating technolog/y
- polysilicon-gate technolog/y
- polysilicon-load technolog/y
- polysilicon self-aligned PSA technolog/y
- polysilicon self-aligned technolog/y
- resistless etching technolog/y
- robotic technolog/y
- scaled process technolog/y
- scaled technolog/y
- Schottky transistor logic technolog/y
- Schottky TTL technolog/y
- screen-and-fire technolog/y
- self-aligned source-drain diffusion technolog/y
- shared silicon technolog/y
- silicide-gate technolog/y
- silicon technolog/y
- silicon-gate technolog/y
- silicon-in-insulator technolog/y
- silicon-in-sapphire technolog/y
- silicon-on-insulator technolog/y
- silicon-on-sapphire technolog/y
- silicon wafer technolog/y
- single-diffused planar technolog/y
- single-diffused technolog/y
- solid-state technolog/y
- spider-bonding technolog/y
- standard bipolar technolog/y
- submicron IC technolog/y
- submicron technolog/y
- subnanosecond technolog/y
- substrate technolog/y
- subtractive technolog/y
- superconducting technolog/y
- surface-mount technolog/y
- system technolog/y
- TAB technolog/y
- tape-automated-bonding technolog/y
- tape bumping technolog/y
- thick-film multilayer technolog/y
- thick-film hybrid technolog/y
- thin-film technolog/y
- trench technolog/y
- trench isolation technolog/y
- TTL technolog/y
- ULA technolog/y
- ultraviolet photolithography technolog/y
- unipolar technolog/y
- V-groove technolog/y
- VHSIC technolog/y
- wafer bumping technolog/y
- water treatment technolog/y
- wiring technolog/y
- X-ray technolog/yEnglish-Ukrainian dictionary of microelectronics > technolog/y
-
11 chip
1) кристал (напр. ІС) 2) інтегральна схема, ІС; мікросхема (див. т-ж circuit, integration) 3) обколювати (напр. кристал) - array chip
- backbonded chip
- balls-down chip
- bare chip
- beam-leadedchip
- beam-leadchip
- bubble-domain chip
- bubble-memory chip
- bumped chip
- committed chip
- component chip
- contiguous-disk bubble chip
- contiguous-disk chip
- custom -built chip
- custom chip
- customizable chip
- dense chip
- discrete-device chip
- electronic chip
- face-down chip
- factory-programmable chip
- fast chip
- fault-free chip
- fault-tolerant chip
- flip chip
- full-wafer chip
- fuse-programmable chip
- gate-array chip
- glue chip
- heterogeneous chip
- highly-расked chip
- hybrid chip
- hyper chip
- IC chip
- individual circuit chip
- integrated-microcircuit chip
- mask-programmable chip
- master-slicechip
- masterchip
- master-slice logic chip
- memory chip
- micro chip
- microcircuit chip
- microprocessor chip
- monolithic chip
- multilead chip
- naked chip
- nongold backed chip
- opto chip
- packaged chip
- pedestal chip
- peripheral chip
- pipelined chip
- planar passivated chip
- Poly Use chip
- process-development chip
- process-validation chip
- resistor chip
- semiconductor chip
- SLS chip
- solder chip
- super chip
- support chip
- TAB chip
- test chip
- thick-film chip
- thin-film chip
- tolerant chip
- ultra chip
- uncommitted chip
- unpackaged chip
- wire-bonded chip
- XR chip
- X-ray made chip
- III-V chip -
12 device
1) прилад (напр. ІС, транзистор, діод); компонент; елемент 2) пристрій - active device
- add-on device
- analog device
- array device
- attached device
- backup device
- beam-leadeddevice
- beam-leaddevice
- bipolar device
- bipolar-MOS device
- blown-fuse device
- bubble-domain device
- bubble- device
- bucket-brigade device
- bulk асoustic-wave device
- bulk-channel carrier-transfer device
- bulk-effect device
- carrier-transfer device
- charge-coupled device
- charge-domain device
- charge-injection device
- charge-priming device
- charge-transfer device
- chip-and-wire device
- CMOS device
- CMOS/SOS device
- compound-semiconductor device
- contiguous-disk device
- controlled surface device
- custom-designed device
- custom device
- dense device
- depletion-modedevice
- depletiondevice
- dielectric isolation device
- diffused device
- discrete device
- double-diffused MOS device
- elastic-surface-wave device
- electrooptic device
- elementary device
- enchancement-mode device
- enchancement device
- end-use device
- epiplanar device
- epitaxial device
- FAMOS device
- field-effect device
- field-programmable device
- FIMOS device
- functional device
- graded-gap semiconductor device
- graded-gap device
- Gurm-effect device
- Gurm device
- Hall-effectdevice
- Halldevice
- hardeneddevice
- harddevice
- heteroepitaxial device
- heterojunction device
- high-gain device
- high-immunity noise device
- high-technology device
- high-threshold device
- homojunction device
- hybrid high-power device
- identification device
- I2L device
- image [imaging] device
- IMPATT device
- implanted device
- integrated-optic device
- integrated semiconductor device
- integration device
- interdigitated device
- interface device
- Josephson-junctiondevice
- Josephsondevice
- Josephson logic device
- junction-isolated device
- large-scale integrated device
- large-scale integration device
- latch-up free CMOS device
- leaded device
- leadless inverted device
- light-wave device
- locked-in device
- logic array device
- low-power Schottky device
- magnetostatic-wave device
- majority-carrier device
- mask-programmable device
- metal-masked device
- metal-semiconductor device
- microdiscrete device
- microelectronic device
- minority-carrier device
- MIS-type device
- MIS device
- mixed-process device
- mixed device
- molecular-beam epitaxy-based device
- monolithic device
- MOS device
- MTL device
- multilayered device
- multilevel device
- n-channel MOS device
- n-channel device
- negative-resistance device
- non-CPU device
- n–p–n device
- off-chip device
- on-chip device
- optocoupler semiconductor device
- optocoupling device
- passive device
- p-channel MOS device
- p-channel device
- peripheral device
- permalloy bubble device
- permalloy T-bar device
- photo-coupled semiconductor device
- photosensitive device
- piezoelectric device
- piggyback device
- planar device
- plotting device
- plug-in device
- p-n-p device
- positioning device
- printing device
- programmable logic-array device
- programmable device
- quantum device
- quantum-well device
- redundancy device
- resin-molded device
- SAW device
- SAW delay device
- scaled-downdevice
- scaleddevice
- Schottky-barrier device
- Schottky device
- second-source device
- self-aligned semiconductor device
- semiconductor-on-sapphire
- silicon-on-dielectric device
- silicon-on-insulator device
- silicon-on-sapphire device
- single device
- single-crystal device
- slow device
- SLS device
- small-geometry device
- solder-evacuator device
- SOS/MOS device
- stacked semiconductor device
- static-sensitive device
- stripeline device
- submicron-scale MOS device
- superconducting Josephson-junction device
- superconducting quantum interference device
- superconductive quantum interferometric device
- super-lattice functional device
- superstructure device
- surface-acoustic-wave device
- surface charge-transfer device
- surface-mounted device
- switching device
- TAB device
- thermocompression bonded device
- thick-film device
- thin-film device
- transcalent device
- transferred-electron device
- transil-time-negative-resistance device
- trench isolated device
- tunnel -еffect device
- tunnel device
- two-level polysilicon MOS device
- ULA device
- ultrafine-scale device
- ultra-large-scale integrated device
- ultra-submicron device
- uncased device
- vertical-junction device
- very large-scale integrated-circuit device
- very large-scale integration device
- V-groove MOS device
- V-groove device
- wafer-printing device -
13 handling
1) маніпулювання; (міжопераційне) транспортування; подача (напівпровідникових пластин) 2) (технологічна) обробка - gas handling
- human handling
- in-process handling
- operator handling
- touchless handling
- tweezer handling
- tweezer-free handling
- wafer handling -
14 module
модуль - basic building-block module
- bubble module
- bulk data interface module
- desoldering vacuum module
- developing module
- fabricationmodule
- fabmodule
- furnace module
- hardening module
- hybrid module
- integrated-circuit module
- microcircuit module
- microcomputer module
- multichip module
- multifunction module
- process validation module
- remote control module
- self-checking computer module
- self-timed module
- space module
- wafer handling module -
15 pattern
1. ім.1) малюнок; зображення; образ; рельєф2) конфігурація, форма2. дієсл. формувати малюнок; формувати зображення; формувати рельєф; структурувати - chip pattern
- circuit pattern
- computer-generated pattern
- conductive pattern
- conductor pattern
- contact pattern
- contiguous-disk propagation pattern
- customized metallization pattern
- discretionary wiring pattern
- dislocation pattern
- domain pattern
- dopant pattern
- electron-beam pattern
- electron diffraction pattern
- emitter pattern
- error-free layout pattern
- etchedpattern
- etchpattern
- fine-line pattern
- fine-linewidth pattern
- fixed-interconnection pattern
- gate pattern
- geometric pattern
- growth pattern
- high-aspect ratio pattern
- insulation pattern
- integrated-circuit pattern
- interconnection mask pattern
- layout pattern
- lead pattern
- mask pattern
- masked реrmalloy pattern
- masking pattern
- master pattern
- measurement pattern
- metal-finger pattern
- multiple pattern
- optical pattern
- oxide pattern
- permalloy propagation pattern
- photographic emulsion-maskpattern
- photographic emulsionpattern
- photoresist film pattern
- photoresist pattern
- photoresist mask pattern
- process evaluation and control pattern
- programmed-interconnection pattern
- regular pattern
- repetitive pattern
- reticle pattern
- routing pattern
- shifting test pattern
- silicon pattern
- step coverage pattern
- striation pattern
- subisolation pattern
- sunken охide pattern
- surface relief pattern
- test pattern
- thick-film pattern
- thin-film pattern
- transistor pattern
- wafer pattern
- wiring pattern -
16 tool
1) інструмент; пристосування; оснащення (напр. фотошаблону) 2) устаткування; верстат 3) піддавати механічній обробці 4) pl (інструментальні) засоби - antistatic tool
- artwork checking tool
- bonding tool
- CAD tools
- CAE/CAD tools
- computer-aided tool
- computer-aided engeneering tools
- computer-based design tools
- design synthesis tools
- desoldering tool
- diamond scribe tool
- DIP/IC insertion tool
- extraction tool
- hand tool
- insertion tool
- lead-forming tool
- lithography tool
- mask inspection tool
- physical layout tools
- pick-up tool
- placement tool
- process characterization tool
- scribing tool
- software tools
- soldering tool
- sputtering tool
- step-and-repeat tool
- wafer-reading tool
- wire-wrapping tool
- work tool -
17 variation
- run-to-run variation
- total thickness variation TTV
- total thickness variation
- within-run process variation
- within-run variationEnglish-Ukrainian dictionary of microelectronics > variation
См. также в других словарях:
Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… … Wikipedia
Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… … Wikipedia
Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a … Wikipedia
Wafer fabrication — is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Wafer… … Wikipedia
Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) … Wikipedia
Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but … Wikipedia
Process corners — In semiconductor manufacturing, a process corner is an example of a design of experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners … Wikipedia
process testing wafer — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… … Radioelektronikos terminų žodynas
process development wafer — technologijos kūrimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process development wafer vok. Testwafer zur Entwicklung der Technologie, m rus. пластина для разработки технологического процесса, f pranc. tranche de test pour … Radioelektronikos terminų žodynas
Process control monitoring — In the application of integrated circuits, process control monitoring (PCM) is the procedur followed to obtain detailed information about the process used. PCM is associated with designing and fabricating special structures that can monitor… … Wikipedia
Czochralski process — The Czochralski process The Czochralski process is a method of crystal growth used to obtain single crystals of semiconductors (e.g. silicon, germanium and gallium arsenide), metals (e.g. palladium, platinum, silver, gold), salts, and synthetic … Wikipedia