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in-process wafer

См. также в других словарях:

  • Wafer-scale integration — Wafer scale integration, WSI for short, is a yet unused system of building very large integrated circuit networks that use an entire silicon wafer to produce a single super chip . Through a combination of large size and reduced packaging, WSI… …   Wikipedia

  • Wafer testing — is a step performed during semiconductor device fabrication. During this step, performed before a wafer is sent to die preparation, all individual integrated circuits that are present on the wafer are tested for functional defects by applying… …   Wikipedia

  • Wafer dicing — is the process by which individual silicon chips or integrated circuits on a silicon wafer are separated following the processing of the wafer. The dicing process can be accomplished by scribing and breaking, by mechanical sawing (normally with a …   Wikipedia

  • Wafer fabrication — is a procedure composed of many repeated sequential processes to produce complete electrical or photonic circuits. Examples include production of radio frequency (RF) amplifiers, LEDs, optical computer components, and CPUs for computers. Wafer… …   Wikipedia

  • Wafer (electronics) — Polished 12 and 6 silicon wafers. The flat cut into the right wafer indicates its doping and crystallographic orientation (see below) …   Wikipedia

  • Wafer prober — A wafer prober is a machine used to test integrated circuits. OverviewIntegrated circuits are fabricated in large numbers by a complex series of printing steps on silicon wafers. This process permits integrated circuits to be produced cheaply but …   Wikipedia

  • Process corners — In semiconductor manufacturing, a process corner is an example of a design of experiments (DoE) technique that refers to a variation of fabrication parameters used in applying an integrated circuit design to a semiconductor wafer. Process corners …   Wikipedia

  • process testing wafer — technologijos tikrinimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process testing wafer vok. Testwafer zur Durchführung der Prozeßkontrolle, m rus. пластина для контроля технологического процесса, f pranc. tranche de test… …   Radioelektronikos terminų žodynas

  • process development wafer — technologijos kūrimo plokštelė statusas T sritis radioelektronika atitikmenys: angl. process development wafer vok. Testwafer zur Entwicklung der Technologie, m rus. пластина для разработки технологического процесса, f pranc. tranche de test pour …   Radioelektronikos terminų žodynas

  • Process control monitoring — In the application of integrated circuits, process control monitoring (PCM) is the procedur followed to obtain detailed information about the process used. PCM is associated with designing and fabricating special structures that can monitor… …   Wikipedia

  • Czochralski process — The Czochralski process The Czochralski process is a method of crystal growth used to obtain single crystals of semiconductors (e.g. silicon, germanium and gallium arsenide), metals (e.g. palladium, platinum, silver, gold), salts, and synthetic …   Wikipedia

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